Exclusive

Publication

Byline

Location

US Patent Issued to Taiwan Semiconductor Manufacturing on April 14 for "Deep trench capacitor (DTC) region in semiconductor package" (Taiwanese Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,741, issued on April 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Deep trench capacitor (DTC) regio... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 14 for "Layout design method and structure with enhanced process window" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,742, issued on April 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Layout design method and stru... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 14 for "Layout design method and structure with enhanced process window" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,742, issued on April 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Layout design method and stru... Read More


US Patent Issued to LPKF LASER & ELECTRONICS on April 14 for "Method for making a recess or opening into a planar workpiece using successive etching" (German Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,743, issued on April 14, was assigned to LPKF LASER & ELECTRONICS AG (Garbsen, Germany). "Method for making a recess or opening into a pla... Read More


US Patent Issued to LPKF LASER & ELECTRONICS on April 14 for "Method for making a recess or opening into a planar workpiece using successive etching" (German Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,743, issued on April 14, was assigned to LPKF LASER & ELECTRONICS AG (Garbsen, Germany). "Method for making a recess or opening into a pla... Read More


US Patent Issued to Intel on April 14 for "Integration of glass core into electronic substrates for fine pitch die tiling" (Arizona Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,744, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Integration of glass core into electronic substrates for fine... Read More


US Patent Issued to Intel on April 14 for "Integration of glass core into electronic substrates for fine pitch die tiling" (Arizona Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,744, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Integration of glass core into electronic substrates for fine... Read More


US Patent Issued to FORMITEK ELECTRIC (ZHOUSHAN) on April 14 for "Switching power device and parallel connection structure thereof" (Chinese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,745, issued on April 14, was assigned to FORMITEK ELECTRIC (ZHOUSHAN) Co. LTD. (Zhoushan City, China). "Switching power device and paralle... Read More


US Patent Issued to FORMITEK ELECTRIC (ZHOUSHAN) on April 14 for "Switching power device and parallel connection structure thereof" (Chinese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,745, issued on April 14, was assigned to FORMITEK ELECTRIC (ZHOUSHAN) Co. LTD. (Zhoushan City, China). "Switching power device and paralle... Read More


US Patent Issued to Renesas Electronics on April 14 for "Method of manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,746, issued on April 14, was assigned to Renesas Electronics Corp. (Tokyo). "Method of manufacturing semiconductor device" was invented by... Read More